Ultrasonic Technology for Chip Interconnection
Transducer Test System
Optical Displacement Measurement System
Optical Displacement Measurement System
(for K&S ball bond machines)
Bond Force Calibration System
(for F&K Delvotec bond machines)
Ultrasonic Transducer
Ultrasonic Transducer
Ultrasonic Transducer
Heavy wire- & Diebond-Transducer
Ultrasonic Transducer
Digital Ultrasonic Generator
(fine wire)
Digital Ultrasonic Generator
(heavy/thick wire- & diebond)
Digital Ultrasonic Generator
(heavy wire, thick ribbon & diebond)
Digital Ultrasonic Generator
(plug-in cards & complete devices)
Customized Solutions

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News & Events
Latest news
Potsdam, April 2024

The information about SEMICON South-East-Asia (SEA) has been addad to the 2024 trade fair calendar. You can learn more about our products and services at the booth of our partner company F&K Delvotec Bondtechnik Singapore.

The 2024 trade fair calendar has been supplemented with stand information for PCIM Nuremberg 2024.

Potsdam, February 2024

The 2024 trade fair calendar has been supplemented with stand information for Semicon Taiwan 2024.

Trade show update

We have made a successful start to the 2024 trade fair year with the NEPCON Tokyo 2024 and Semicon Korea 2024 trade fairs.

Show calender 2024

Semicon SEA
2024, May 28 to 30
MITEC, Kuala Lumpur, Malaysia
PCIM Nuremberg
2024, June 11 to 13
Messezentrum Nürnberg, Germany
Semicon Taiwan
2024, September 4 to 9
TaiNEX 1 & 2, Taipei, Taiwan
F&K Physiktechnik GmbH
About us
Mike Kölling Since 2002 F&K Physiktechnik GmbH Potsdam has been developing and manufacturing products and processes that are used worldwide for chip interconnection in microelectronic production.

Building Potsdam

F&K Physiktechnik GmbH focuses on ultrasound technology

Our customers apply our generators and transducers for their projects in ultrasonic wire bonding and ultrasonic die bonding.

In addition, we offer unique measurement technology for characterizing and optimally setting up ultrasonic systems in bonding machines.

System supplier for all users of ultrasonic bonding technology.

Product and service overview
Ultrasonic Transducer
Ultrasonic Transducer for all bonding technologies

More Information

Digital Ultrasonic Generators
Optimally adapted ultrasonic frequencies and powers for all bonding technologies
(also for transducers from other manufacturers)

More Information

Transducer Test System
Worldwide unique measurement system to determine the electrical properties of every ultrasonic transducer

Standard tool for checking the production equipment

More Information

Optical Displacement Measurement System - ODS-Series
Determine the vibration amplitude and frequency of the bonding tool by non-contact measurement

Vibration amplitude based calibration of the bonding machine for perfect machine matching

Ideal extension to the Transducer Test System

More Information

Bond Force Calibratioon System
Static and dynamic bond force measurements

Communication interface to F&K Delvotec wire bonders for automatic bond force calibration

More Information

Your service provider with many years of expertise in ultrasound in wire and die bonding

Experience in the development and production of digital ultrasound systems for chip interconnection since 1996

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Bi-directional Alignment Laser
The tool for quick and easy alignment of optical experiments,
especially for experiments outside the visible spectrum

More Information

Our product catalogue for downloading (approx. 9 MB)

  • PDFF&K Products


    If you have any questions, please email us at

    Our responsible employee will contact you directly.



    F&K Physiktechnik GmbH
    Wetzlarer Str. 54
    14482 Potsdam

    Contact person: Mike Kölling

    Contact info:
    Phone: +49 331 60028920
    International sales organisation