FKPT
Ultrasonic Technology for Chip Interconnection
Transducer Test System
TTS-030
Optical Displacement Measurement System
ODS-20
Optical Displacement Measurement System
(for K&S ball bond machines)
ODS-21
Bond Force Calibration System
(for F&K Delvotec bond machines)
BFS-20
Ultrasonic Transducer
Ball-Wedge-Transducer
Ultrasonic Transducer
Wedge-Wedge-Transducer
Ultrasonic Transducer
Heavy wire- & Diebond-Transducer
Ultrasonic Transducer
Power-Transducer
Digital Ultrasonic Generator
(fine wire)
UUG-050
Digital Ultrasonic Generator
(heavy/thick wire- & diebond)
UUG-040
Digital Ultrasonic Generator
(heavy wire, thick ribbon & diebond)
UUG-050-X
Digital Ultrasonic Generator
(plug-in cards & complete devices)
Customized Solutions

Use arrow keys ❮ ❯ to scroll.

 
News & Events
Latest news
Potsdam, February 2022
PTP Transducer serie

We proudly announce the release of the first members of our new Ultrasonic Power-Transducer series. Available working frequencies are approximately 35 kHz and 44 kHz.

Trade show update
PCIM Europe 2022 will take place from May 10th till 12th, 2022 in Nuremberg - Germany. At same time and place SMTConnect 2022 (digital and hybrid) will be held.

We exhibit at:
PCIM Logog

PCIM 2022

  • May 10 - 12; 2022, Nuremberg
  • Messezentrum Nürnberg
  • booth No. 6-429
  • Hall 6

We are looking forward seeing you there.

 
F&K Physiktechnik GmbH
About us
Mike Kölling Since 2002 F&K Physiktechnik GmbH Potsdam has been developing and manufacturing products and processes that are used worldwide for chip interconnection in microelectronic production.

Building Potsdam

F&K Physiktechnik GmbH focuses on ultrasound technology

Our customers apply our generators and transducers for their projects in ultrasonic wire bonding and ultrasonic die bonding.

In addition, we offer unique measurement technology for characterizing and optimally setting up ultrasonic systems in bonding machines.

System supplier for all users of ultrasonic bonding technology.

 
Product and service overview
Ultrasonic Transducer
Ultrasonic Transducer for all bonding technologies

More Information

Digital Ultrasonic Generators
Optimally adapted ultrasonic frequencies and powers for all bonding technologies
(also for transducers from other manufacturers)

More Information

Transducer Test System
Worldwide unique measurement system to determine the electrical properties of every ultrasonic transducer

Standard tool for checking the production equipment

More Information

Optical Displacement Measurement System - ODS-Series
Determine the vibration amplitude and frequency of the bonding tool by non-contact measurement

Vibration amplitude based calibration of the bonding machine for perfect machine matching

Ideal extension to the Transducer Test System

More Information

Bond Force Calibratioon System
Static and dynamic bond force measurements

Communication interface to F&K Delvotec wire bonders for automatic bond force calibration

More Information

Services
Your service provider with many years of expertise in ultrasound in wire and die bonding

Experience in the development and production of digital ultrasound systems for chip interconnection since 1996

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Bi-directional Alignment Laser
The tool for quick and easy alignment of optical experiments,
especially for experiments outside the visible spectrum

More Information

Our product catalogue for downloading (approx. 9 MB)

  • PDFF&K Products

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    Support

    If you have any questions, please email us at info@fkphysiktechnik.com

    Our responsible employee will contact you directly.

     
    Contact

    Address:

    F&K Physiktechnik GmbH
    Wetzlarer Str. 54
    14482 Potsdam
    Germany

    Contact person: Mike Kölling

    Contact info:
    Phone: +49 331 60028920
    info@fkphysiktechnik.com
    International sales organisation