FKPT
 
Ultrasonic Transducer
 

Ultrasonic transducer of highest quality for all bonding applications in microelectronics:

  • Fine (thin) wire wedge-wedge bonding

  • Fine (thin) wire ball-wedge bonding

  • TAB bonding

  • Heavy (thick) wire bonding

  • Thick ribbon bonding

  • Ultrasonic (flip-chip) die bonding

  • Customized transducer:

Transducer

Key properties & parameters

  • Frequency range from 40 kHz to 150 kHz

  • best materials

  • carefully selected piezos for best stability

  • Transducer "Made in Germany"

 
Fine (thin) Wire Wedge-Wedge Transducer
Model Frequency   Remarks
FK065D-1 65 kHz    
FK100C-0 102 kHz    
FK100C-3 102,5 kHz   SAW filter model
PTW100A0 102 kHz   for price sensitive applications
FK120N 119 kHz    
FK140R-1 139,5 kHz    
Wedge Transducers
 
Fine (thin) Wire Ball-Wedge Transducer
Model Frequency   Remarks
FK066G 66 kHz   short design
FK067X 67 kHz   for PHICOM Bonder
PTB065A0 64,8 kHz   for price sensitive applications
FK100F-2 106 kHz    
FK120S-2 119 kHz    
FK145P 143,5 kHz    
Ball Transducer
 
Heavy (thick) Wire & Die Bonding Transducer
Model Frequency   Remarks
FK040-U 40 kHz    
FK065A 57 kHz   Standard Heavy Wire Transducer
also suitable for Die Bonding
FK058HR 57 kHz   Two set screws
FK090Z-1 90 kHz   Standard Die Bonding Transducer
FK120K 119 kHz    
Dickdraht Transducers
 
TAB Bonding Transducer
Model Frequency   Remarks
FK065TAB 65 kHz    
 
Customized Transducer
  • Didn't find a suitable model?
  • We develop the right transducer for you.
  • Please send your inquiry to info@fkphysiktechnik.com.

 
Digital Ultrasonic Generators
 

The ultrasonic generator family of choice:

  • to be used with any ultrasonic transducer model for wire and die bonding machines

  • for all power levels, starting with very thin wire bonding up to heavy ribbon bonding (HARB)

UUG-040

Key properties & parameters

  • Can be used with ultrasonic transduers of all brands

  • full digital control loops

    • digital PLL (Phase Lock Loop)

    • digital power control loop

    • digital triggering (bond power & bond time)

  • direct digital synthesis of the ultrasound

  • Measurement functions available during the bond cycle

    • Transducer current

    • Transducer voltage

    • Impedance

    • Remark: Scope of measurement options depending on the generator model. Further measured variables on request.

 
Fine (thin) Wire Generators

UUG-050-S

  • Frequency range: (40 - 200) kHz
  • Max. output voltage: 11,5 Vrms
    • Standard type

UUG-050-U

  • Frequency range: (40 - 200) kHz
  • Max. output voltage: 11,5 Vrms
    • Replacement model for Uthe 10H-P2

UUG-050-N

  • Frequency range: (40 - 200) kHz
  • Max. output voltage: 11,5 Vrms
    • for PHICOM ball bonder

UUG-050-B

  • Frequency range: (40 - 150) kHz
  • Max. output voltage: 25 Vrms
    • extended output power
    • also suitable for die bonding (low bump counts)
UUG-040
  • More information:
  • PDFData sheet UUG-050 series
 
Heavy (thick) Wire and Die Bonding Generators

UUG-040-S

  • Frequency range: (30 - 150) kHz
  • Max. output voltage: 39 Vrms
    • Standard type for heavy wire bonding
    • Die bonding of small and medium bump counts
UUG-040
  • More information:
  • PDFData sheet UUG-040

UUG-050-X

  • Frequency range: (40 - 200) kHz
  • Max. output voltage: 100 Vrms
    • for heavy ribbon bonding (HARB)
    • for die bonding at high bond forces and high bump counts
UUG-040
  • More information:
  • PDFData sheet UUG-050-X
 
Customized Generators
  • Didn't find a suitable model?
  • Please contact us if you couldn't find a suitable generator for your application in this list. We also offer customer-specific adaptation of existing systems and special developments according to your requirements.
  • Selection of realized generators for our customers:

    • Wire bond generators
    • Die bond generators
    • Generators for wafer bonding
    • Generators for chemical and biological processing
    • Generators for measurement applications
Generatorboard
 
 
 
Measuring Equipment - Transducer Test System

The standard tool for the process engineer to:

  • secure and improve the bonding quality

  • increase the yield of the bond process

  • reduce bond failure rate

  • increase bond machine uptime

TTS-030

Key properties & parameters

  • Every ultrasonc transducer for wire and die bond machines can be checked
    • independent from machine model and brand

    • easy to use

  • Gathering of all essential measured variables:

    • Resonance frequency

    • Impedance

    • Phase angle

  • can be combined with optical vibration excursion measuring systems of the ODS series

  • Accessories to extend scope of possibilities

 

Field of Applications

  • Acquisition and documentation of the electrical properties of the ultrasonic system of the bonding machine
    • preventive maintenance by regular checking

    • objective research for the root cause of ultrasound-related bonding problems

    • independent verification of the machine-internal status information for the ultrasonic system

    • documentation of the current machine status in the quality management system (QMS)

  • Research on the impact of the bonding tool on the ultrasonic transducer

    • proper selection of the bonding tool to the bond process

  • Training of machine operators and service employees

    • efficient tool for visualizing the results of work on the ultrasound system

    • identify changes caused by maintenance work

    • learning to change tools correctly

  • Income control for ultrasonic transducers

TTS-Beispielkurve
 
TTS-030 - important technical data
Measured values Transducer current, phase angle and impedance (as a function of frequency)

Resonance frequency

Transducer impedance at resonance frequency

Vibration excursion at the bonding tool (if combined with optical displacement measurement system of ODS series)

Scan range
(Frequency range)
20 kHz - 200 kHz
Power ranges Fine Wire Package: 5Watts @ 22 Ω

Heavy Wire / Diebond Package: 30Watts @ 32 Ω

Accuracy ± 2,5% (Full Range)
Dimensions / Weight 39cm x 27cm x 16,5cm / 7,95 kg
Storage case dimensions 51cm x 41cm x 20cm

More information:

PDFData sheet TTS-030

 
Accessories for TTS-030
  • Transducer Test Set
    • external (outside of the bond head) measurement of transducer
      (e.g. during income control of spare transducers)

    • set of clamps for common barrel diameters
      (0,5“ - 0,6“ - 0,75“ - 13mm & 16mm)

    • micromanipulator with holder for standard ODS sensor

    • custom-made clamps on request

Test Set
  • Transport and storage case TTS-ODS
    • for TTS-030, ODS-20/ODS-21 and accessories

Koffer groß
  • TTS-Transducer cable for different transducer models
    • for F&K Delvotec G4 wire bonder

KnS-ASM-Kabel
    • for F&K Delvotec G5 wire bonder

KnS-ASM-Kabel
    • for KnS and ASM ball bonder

KnS-ASM-Kabel
    • Custom-made TTS-Transducer cable on request

KnS-ASM-Kabel
 
Measuring Equipment - Optical vibration excursion measurement systems

The standard tool for the process engineer to:

  • determine the vibration amplitude of the bonding tool

  • carry out a vibration excursion based calibration of the ultrasonic system of a bond machine

  • evaluate the efficiency of the ultrasonic transducer
    to convert electrical energy into mechanical vibration

  • Check correct execution of a tool change

  • Optional: check and calibrate bond force unit of a bond machine
    (2-in1 system)

ODS-20

Key properties & parameters

  • determine vibration amplitude and vibration frequency of the ultrasonic transducer of a wire or die bonding machine

    • contactless measurement (optical sampling)

    • independent from machine model and brand

    • easy to use

    • standard sensor head suitable for most modern bond machines

    • special sensor head designs available

  • 2-in-1 system: measure vibration amplitude and bond force (optional) with one system

  • Gathering of all relevant measured values

    • Vibration amplitude (peak-peak)
    • Vibration frequency
    • Bond force (optional)
  • can be combined with Transducer Test System TTS-030

  • Accessories for erweiterte Nutzungsmöglichkeiten

 

Field of Applications

  • Vibration excursion based calibration of the ultrasonic system of bond machines
    • same parameter set for same product on all machines (of same model)

  • Gathering and documentation of the actual vibration amplitude at the bonding tool of the bond machine

    • preventive maintenance by regular checking

    • objective research for the root cause of ultrasound-related bonding problems

    • documentation of the current machine status in the quality management system (QMS)

  • Evaluate the impact of the bonding tool to the ultrasonic transducer

    • proper selection of the bonding tool to the bond process
    • determine the natural frequencies of the bond tool by combination with the Transducer Test System TTS-030
  • Training of machine operators and service employees

    • identify changes due to maintenance work on the bond head
    • learning to change tools correctly
  • Optionally available force measuring allows checking and calibration of the bond force unit of the bonding machine

TTS-ODS-Beispiel
 
ODS-20 - standard system - important technical data
Measured values mechanical vibration amplitude (Spitze-Spitze)

mechanical vibration frequency

bond force (optional)

Vibration amplitude up to 20 µm (peak-peak)
resolution down to nanometers
Vibration frequency 30 kHz - 250 kHz
Bond force (optional) up to 20 N (2kgs)

higher forces possible on request

Laser class class II (eye safe)
visible red light
Dimensions / Weight
  Sensor head 62.8mm x 15mm x 20.1mm / 40g
  Main unit 20.5cm x 15.3cm x 8cm / 1.1kgs
Storage case dimension 39.2cm x 29.5cm x 10.5cm
Special sensor heads for Shinkawa ball bonders
TDK die bonders

please see Accessories

More information:

PDFData sheet ODS-20

 
ODS-21 - special system for KnS ball bonder - important technical data
Measured values mechanical vibration amplitude (Spitze-Spitze)

mechanical vibration frequency

bond force (optional)

Vibration amplitude up to 2 µm (peak-peak)
resolution down to nanometers
Vibration frequency 30 kHz - 150 kHz
Bond force (optional) up to 20 N (2kgs)

higher forces possible on request

Laser class class II (eye safe)
visible red light
Dimensions / Weight
  Sensor head 62.8mm x 25.4mm x 18mm / 46g
  Main unit 20.5cm x 15.3cm x 8cm / 1.1kgs
Storage case dimension 39.2cm x 29.5cm x 10.5cm

More information:

PDFData sheet ODS-21

 
Accessories for optical vibration excursion measuring systems
  • Transducer Test Set
    • external (outside of the bond head) measurement of transducer
      (e.g. during income control of spare transducers)

    • set of clamps for common barrel diameters
      (0,5“ - 0,6“ - 0,75“ - 13mm & 16mm)

    • micromanipulator with holder for standard ODS sensor

    • custom-made clamps on request

Test Set
  • Mikromanipulator with holder for standard ODS sensor
    • for use at manual wire bonders (Hybond or similar)

Mikromanipulator
  • Special sensor head
    • for Shinkawa ball bonder

  • Special sensor head
    • for TDK die bonder

 
Measuring Equipment - Bond Force Calibration System

The standard tool for the process engineer to:

  • check the bond force unit of a bond machine

  • calibrate the bond force unit of a F&K Delvotec bonder

  • analyze the force development from touch down to lift off of the bond head

BFS-20

Key properties & parameters

  • Bond force measurement and documentation (static and dynamic measurements)

    • independent from machien modle and brand
    • easy to use
    • standard sensor head suitable for most modern bond machines
    • special sensor heads available
Kraftbeispiel 1
 

Field of Applications

  • Check the applied bond force

    • static measurement
  • Check the bond force development

    • dynamic measurement
    • touch down behaviour of the bond tool (bond head)
    • stability of the applied bond force over full bond cycle
  • Calibration of the bond force unit

    • automatic calibration run on F&K Delvotec bonder using serial communication
    • manual calibration for other brands, depending on the possibilities of the bonder model
Kraftbeispiel 1
 
BFS-20 - important technical data
Measured values Bond force
Force range up to zu 20 N (2 kgs)
higher force possible on request
static and dynamic measurements
Dimensions / Weight
  Sensor head 62.8mm x 15mm x 14mm / 40g
  Main unit 20.5cm x 15.3cm x 8cm / 1.1kgs
Storage case dimension 39.2cm x 29.5cm x 10.5cm
Special sensor heads for Shinkawa ball bonders
KnS ball bonders

More information:

PDFData sheet BFS-20

 
Bi-directional alignment laser

The alignment tool to:

  • quick and easy adjustment of optical experiments

  • especially for experiments outside the visible spectrum

Justierlaser

Key properties & parameters

  • Two accurate laser beams in opposite directions

  • Rechargeable battery for simple operation

  • compact design of the bi-directional alignment laser for easy integration into the optical experiment

Justierlaser
 
LA-01MB-AK - important technical data
Color of laser light red (635 nm)
Laser class Class II (eye safe)
Beam diameter approx. 1.4 mm
Beam divergence approx. 0.7 mrad
Alignment error between the two beams <0.5 mrad
Dimension / Weight 42mm x 45mm x 75mm / 320g

More information:

PDFData sheet LA-01MB-AK

 
Services
 

Your service provider with:

  • many years of expertise in ultrasonic technology in wire and die bonding

  • experience in the development and production of digital ultrasonic systems for chip interconnections since 1996

Vibrometer
Our range of services
.
  • development of customer-specific ultrasonic transducers

  • development of customer-specific ultrasonic generators

  • vibration measurements on site (laser interferometry)

  • vibration measurements on customer parts (in-house)

  • consulting on the ultrasonic bond process

  • bondability studies

Analysediagramm
Last Modified July 8, 2021